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Chip EMI Filters
Chip EMI Filters
Type:
EXCCET
Features
Rated current (2 A max.) Eight capacitance values in a wide range, related to the noise frequency Suitable for narrow pitch insertion Suitable for applications requiring thin design
Recommended Applications
Digital equipment such as PCs, word processors, printers, HDD, PPC, and communication equipment. Digital audio and video equipment. AC adapters, and switching power supplies. Electronic musical instruments, and other digital equipment.
Explanation of Part Numbers
1 2 3 4 5 6 7 8 9 10
E
X
Product Code
C
C
Type
E
Circuit
T
1
0
Nominal Capacitance Value
3
U
Form
Noise Filter
Chip type
T-circuit EMI filter
The first two digits are significant figures of capacitance value and the third one denotes the number of zeros following.
Code U
Packing Embossed Carrier Taping
Construction
Ferrite core
Dimensions in mm (not to scale)
0.50.2 4.50.4 Adhesive 1.00.2
0.50.2 1.80.2
Chip capacitor
Electrode
Size : 1807 inches Mass (Weight) : 92.5 mg/pc.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately.
2.70.3
Feb. 2007
Chip EMI Filters
Ratings
Part Number EXCCET220U EXCCET470U EXCCET101U EXCCET271U EXCCET471U EXCCET102U EXCCET222U EXCCET103U Rated Voltage (V DC) 50 50 50 50 50 50 50 50
(1)
Capacitance (pF) 22 47 100 270 470 1000 2200 10000
Rated DC 25 dB Attenuate 15 dB Attenuate (2) Tolerance Frequency Frequency Characteristics Current Resistance (%) (A DC) (m ) (MHz) (MHz) 20 20 20 20 20 20 20 20 YB YB YB YB YB YB YB YB 2 2 2 2 2 2 2 2 50 max. 50 max. 50 max. 50 max. 50 max. 50 max. 50 max. 50 max. 800 to 1000 450 to 550 300 to 450 200 to 300 100 to 220 65 to 200 35 to 180 15 to 120 600 to 1000 350 to 1000 200 to 900 80 to 700 50 to 700 30 to 700 15 to 700 15 to 700
(1) Please inquire to us about the particular capacitance value, on a range of 22 to 10000 pF. (2) Characteristics YB: Maximum capacitance is 10 % over the temperature range of -25 C to +85 C in reference to +20 C.
Attenuation Characteristics (Reference Data)
0 Attenuation(dB) 10 20 50 30 40 222 102 50 60 1M 10M Frequency (Hz) 100M 1G 103 101 471271 470 220 Sample
Measurement Circuit
~
50
Packaging Methods (Taping)
Standard Quantity Part Number EXCCET U Kind of Taping Embossed Carrier Taping Pitch (P1) 4 mm Quantity 1000 pcs./reel
Embossed Carrier Taping
Taping Reel
T
t1 Sprocket hole D0 A B
Compartment FE W
E C B W
D
t2 Chip component
P1 P2 P0
Tape running direction
A
A
B
W
F
E
P1
Dimensions (mm)
A
0 180.0-3.0
B 60.01.0 W
C 13.00.5 T
D 21.00.8
Dimensions 2.20.2 4.90.2 12.00.2 5.500.05 1.750.10 4.00.1 (mm)
P2
P0
D0
t1
t2
Dimensions (mm)
E 2.00.5
Dimensions 2.00.1 4.00.1 1.5+0.1 0.350.05 3.5 max. 0 (mm)
13.01.0 16.5 max.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately.
Sep. 2009
Chip EMI Filters
Recommended Land Pattern Design(mm)
For Single Mounting
Resist 1.15 0.2 1.0 Copper foil
For High Density Mounting
0.2 Resist 1.0 Copper foil
1.15
1.4
2.54
Resist
5.4
Using the land pattern which we do not recommend, or mounting by the solder under 180m, verify the performance, reliability, etc. thoroughly.
1.3 5.4
1.3
Recommended Soldering Conditions
Recommendations and precautions are described below. Recommended soldering conditions for reflow * Reflow soldering shall be performed a maximum of two times. * Please contact us for additional information when used in conditions other than those specified. * Please measure the temperature of the terminals and study every kind of solder and printed circuit board for solderability before actual use.
Peak Temperature Preheating Heating
For soldering (Example : Sn-37Pb) Preheating Main heating Peak Temperature 140 C to 160 C Above 200 C 235 10 C Time 60 s to 120 s 30 s to 40 s max. 10 s
For lead-free soldering (Example : Sn/3Ag/0.5Cu) Temperature Time Preheating 150 C to 170 C 60 s to 120 s Main heating Above 230 C 30 s to 40 s Peak max. 260 C max. 10 s
Time
Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 C or less. Solder each electrode for 3 seconds or less. Never touch this product with the tip of a soldering iron.
Safety Precautions
The following are precautions for individual products. Please also refer to the precautions common to EMI Filters, ESD Suppressors, Fuses, and MR Sensors shown on page EL113 of this catalog. 1. Chip EMI Filters (hereafter called the filters) cannot be mounted on a printed circuit board by flow soldering. Mount them by reflow soldering. 2. Use rosin-based flux or halogen-free flux. 3. For cleaning, use an alcohol-based cleaning agent. Before using any other type, consult with our sales person in advance. 4. Do not apply shock to the filters or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, their bodies may be chipped, affecting their performance. Excessive mechanical stress may damage the filters. Handle with care. 5. Avoid applying static electricity to the filters. 6. The performance of the filters deteriorates in a circuit that is susceptible to surges or other abnormal voltages. Carefully check the circuit operations before use. 7. Store the filters in a location with a temperature ranging from -5 C to +40 C and a relative humidity of 40 % to 60 %, where there are no rapid changes in temperature or humidity. 8. Use the filters within a year after the date of the outgoing inspection indicated on the packages.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately.
1.4 Sep. 2009
1.3
1.3
1.4
Safety Precautions (Common precautions for EMI Filters, ESD Suppressors, Fuses, and MR Sensors)
* When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifications with us in advance. The design and specifications in this catalog are subject to change without prior notice. * Do not use the products beyond the specifications described in this catalog. * This catalog explains the quality and performance of the products as individual components. Before use, check and evaluate their operations when installed in your products. * Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment where a defect in these products may cause the loss of human life or other significant damage, such as damage to vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment. Systems equipped with a protection circuit and a protection device Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault (1) Precautions for use * These products are designed and manufactured for general and standard use in general electronic equipment (e.g. AV equipment, home electric appliances, office equipment, information and communication equipment) * These products are not intended for use in the following special conditions. Before using the products, carefully check the effects on their quality and performance, and determine whether or not they can be used. 1. In liquid, such as water, oil, chemicals, or organic solvent 2. In direct sunlight, outdoors, or in dust 3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2 4. Electric Static Discharge (ESD) Environment (except ESD Suppressors) These components are sensitive to static electricity and can be damaged under static shock (ESD). Please take measures to avoid any of these environments. Smaller components are more sensitive to ESD environment. 5. Electromagnetic Environment Avoid any environment where strong electromagnetic waves exist. 6. In an environment where these products cause dew condensation 7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin or other materials * These products generate Joule heat when energized. Carefully position these products so that their heat will not affect the other components. * Carefully position these products so that their temperatures will not exceed the category temperature range due to the effects of neighboring heat-generating components. Do not mount or place heat-generating components or inflammables, such as vinyl-coated wires, near these products (except Thermal Cutoffs). * Note that non-cleaning solder, halogen-based highly active fl ux, or water-soluble flux may deteriorate the performance or reliability of the products. * Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water residues. Otherwise, the insulation performance may be deteriorated. (2) Precautions for storage The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your company, provided that they remain packed as they were when delivered and stored at a temperature of 5 C to 35 C and a relative humidity of 45 % to 85 %. (Micro Chip Fuses: Guaranteed for 6 months from the date of arrival at your company) The performance of EMI Filters is guaranteed for 6 months or a year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of -5 C to +40 C and a relative humidity of 40 % to 60 %. Check the guarantee period in the specifications. The performance of Thermal Cutoffs is guaranteed for a year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of -10 C to +40 C and a relative humidity of 30 % to 75 %. Even within the above guarantee periods, do not store these products in the following conditions. Otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures. 1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2 2. In direct sunlight
Package markings include the product number, quantity, and country of origin. In principle, the country of origin should be indicated in English.
Jan. 2008
- EL113 -

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